Right now, the most advanced nodes that Samsung uses to make chips for automobiles are its 28FDS and 14 nm technologies, so an 8 nm node will be a huge step forward.As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in the coming years. The 7-nm node will meet Grade 1 AEC-Q100 automotive standards by the end of the year. However, follow-on 1z and 1a nodes will increasingly use EUV, suggested Samsung’s head of DRAM development, Seong Jin Jang, in a talk here.Samsung developed its own system to compare and fix expected and actual mask patterns to speed EUV into production. At present, Samsung has two manufacturing processes that are defined as 8 nm: 8LPP and 8LPU, which are evolved from the company’s 10 nm node. Since then, EUV systems have hit a peak 280 W, and Samsung targets 300 W, he said.Another analyst said that Cisco, a customer of the former IBM foundry business, is now working with TSMC for 7nm products. The prediction is based more on growth in its memory business, in which he estimates Samsung will rise to command 50% of DRAM and 45% of NAND sales. They hit 3.2 million operations/second at 170 W compared to its existing 128-GB cards delivering 3.8 million ops/s at 225 W.The 7LPP process will deliver up to a 40% shrink and up to 20% higher speeds or 50% lower power consumption compared to its 10nm node. Samsung has the best wafer pricing the industry has ever seen. To produce those SoCs, specialized manufacturing lines will be needed, which is why the two leading contract chip makers, Samsung and TSMC, are working on new nodes and IP aimed precisely at automobiles. PDKs for the nodes could be released before the end of the year, and a second shell for EUV production is being built next to the S3 fab, said Stear.Both Samsung and TSMC will apply EUV probably only to two chip layers at 7nm, so far not using protective pellicles that are still in development, said Handel Jones, president of International Business Strategies.
Update: Samsung has updated the information of its 7nm LPP process node in the subsequent 5nm and 4nm roadmaps (the second generation of 7nm previously defined by Samsung seems to have been clearly identified as 5nm LPE, and the original 7nm LPE has become Clear Samsung 7nm node-and currently no distinction between LPE and LPP). It is likely that the automotive-grade 8 nm will be a further evolution of that technology. Pricing. The 7-nm node will meet Grade 1 AEC-Q100 automotive standards by the end of the year. To catch up … G. Dan Hutcheson of VLSI Research described it as a mask review system because it’s unclear if it is as automated as typical third-party inspection systems.“Samsung is about six months ahead with an EUV process because they have been using the systems with DRAM and logic, but TSMC is way ahead in enablement with IP and tools and is working with more customers such as AMD, Apple, HiSilicon, and Nvidia, among others,” said Jones.“We’re doing contact-over-gate in steps,” said Stear. In packaging, Samsung is developing an RDL interposer that will enable up to eight HBM stacks on a single device. Separately, Samsung said that it now has 50 foundry partners including Ansys, Arm, Cadence (which has digital and analog flows for 7 nm), Mentor, Synopsys, and VeriSilicon, which said that it taped out a chip in the 7nm process.In its core memory business, Samsung said that it is sampling 256-GByte RDIMMs made with its 16-Gbit chips. However, Samsung expects no customer announcements until early next year.The 7-nm node will meet Grade 1 AEC-Q100 automotive standards by the end of the year.
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